Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression - ScienceDirect
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Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars
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Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression - ScienceDirect
Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars
Research Nuclear Materials Group
Size dependent strength, slip transfer and slip compatibility in nanotwinned silver - ScienceDirect
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